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类型 Type | Ceramic |
谐振频率 Frequency | 8MHz |
频率容差 Frequency Tolerance | ±0.5% |
频率稳定性 Frequency Stability | ±0.2% |
负载电容 Load Capacitance | 21pF |
谐振阻抗 Resonant impedance | |
Description & Applications | FEATURES • Encased in a ceramic package • High reliability against soldering heat and mechanical stress • Moisture-proof sealing • 1.2 mm maximum (SS/SM/BM/JM),0.8 mm maximum (ST) in thickness • Designed for refl ow soldering • Flat-bottom plate for better mountings • Simplifi es oscillation circuits by reducing the number of circuit parts • RoHS compliant |
描述与应用 | 特点 •陶瓷封装包 •高可靠性,以防止焊接热和机械应力 •防潮密封 •1.2毫米最大(SS/ SM/ BM/ JM),0.8毫米的厚度最大(ST) •专为回流焊接 •平底板更好的架 Simplifi上课振荡电路,通过减少电路部件的数量 •符合RoHS标准 |